Modeling And Simulation For Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly PDF Book Detail:
Author: Sheng Liu
Publisher: John Wiley & Sons
ISBN: 0470828412
Size: 56.66 MB
Format: PDF, ePub, Mobi
Category : Technology & Engineering
Languages : en
Pages : 288
View: 1591

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Book Description: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Fan Out Wafer Level Packaging

Fan Out Wafer Level Packaging PDF Book Detail:
Author: John H. Lau
Publisher: Springer
ISBN: 9811088845
Size: 52.79 MB
Format: PDF, Mobi
Category : Technology & Engineering
Languages : en
Pages : 303
View: 3119

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Book Description: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Nist Serial Holdings

NIST Serial Holdings PDF Book Detail:
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Size: 58.68 MB
Format: PDF
Category : Engineering
Languages : en
Pages :
View: 6690

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Book Description:

Influence Of Temperature On Microelectronics And System Reliability

Influence of Temperature on Microelectronics and System Reliability PDF Book Detail:
Author: Pradeep Lall
Publisher: CRC Press
ISBN: 9780849394508
Size: 78.81 MB
Format: PDF, ePub, Mobi
Category : Technology & Engineering
Languages : en
Pages : 336
View: 3976

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Book Description: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The final chapter overviews existing guidelines for thermal derating of microelectronic devices, which presently involve lowering the junction temperature. The reader then learns how to use physics-of-failure models presented in the previous chapters for various failure processes, to evaluate the sensitivity of device life to variations in manufacturing defects, device architecture, temperature, and non-temperature stresses.

International Microelectronics And Packaging Society

International Microelectronics And Packaging Society PDF Book Detail:
Author:
Publisher:
ISBN:
Size: 38.23 MB
Format: PDF
Category : Associations, institutions, etc
Languages : un
Pages :
View: 7131

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Book Description: International Microelectronics And Packaging Society (IMAPS) is known for the high quality of the technical programs produced. Cutting edge and long-term research and development is presented in venues from the informal and focused Advanced Technology Workshops to the more formal International Symposia. Advancing Microelectronics and the International Journal of Microcircuits and Electronic Packaging are its two main "print" publications.