1998 Fourth International High Temperature Electronics Conference

1998 Fourth International High Temperature Electronics Conference PDF Book Detail:
Author: IEEE Electron Devices Society
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Size: 36.95 MB
Format: PDF
Category : Technology & Engineering
Languages : en
Pages : 332
View: 4154

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Book Description: These papers discuss the need for and status of high temperature electronics development with particular reference to semiconductor materials, devices and applications, passive components, ohmic contacts and metallizations, testing at high temperatures, and thermal management.

Monolithic Integration Of Electronics And Mems In 6h Silicon Carbide For Use In Harsh Environment Applications

Monolithic Integration of Electronics and MEMS in 6H Silicon Carbide for Use in Harsh Environment Applications PDF Book Detail:
Author: Eskinder Hailu
Publisher:
ISBN:
Size: 39.96 MB
Format: PDF, ePub, Mobi
Category :
Languages : en
Pages : 440
View: 3448

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Book Description: Monolithic integration of MEMS and electronics on silicon has been successfully implemented over the past several years. The major challenge in integration of SiC based MEMS with electronics involves processing. Due to SiC's inertness to most wet etch chemistry employed in silicon CMOS processes, one has to revert to plasma based etch to form the MEMS structure. This provides a unique challenge during electronic device integration. The major objective of this work is the development of a design and fabrication methodology for the first monolithic integration of SiC MEMS with SiC electronic devices and circuits. We have developed a novel design and process methodology to achieve this goal. My contribution to this effort is focused mainly on the circuit design and integration with MEMS, as well as fabrication of electronic devices and signal conditioning circuitry. Using our process we have been able to demonstrate functional electronic devices and circuits that operate at 280°C. These results demonstrate the feasibility of the monolithic integration of SiC electronics with SiC MEMS.

Extreme Environment Electronics

Extreme Environment Electronics PDF Book Detail:
Author: John D. Cressler
Publisher: CRC Press
ISBN: 143987431X
Size: 10.67 MB
Format: PDF
Category : Technology & Engineering
Languages : en
Pages : 1041
View: 1640

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Book Description: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Harsh Environment Electronics

Harsh Environment Electronics PDF Book Detail:
Author: Ahmed Sharif
Publisher: John Wiley & Sons
ISBN: 3527813993
Size: 30.87 MB
Format: PDF, ePub
Category : Technology & Engineering
Languages : en
Pages : 400
View: 312

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Book Description: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Solder Joint Reliability Prediction For Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments PDF Book Detail:
Author: Andrew E. Perkins
Publisher: Springer Science & Business Media
ISBN: 0387793941
Size: 25.59 MB
Format: PDF, Kindle
Category : Technology & Engineering
Languages : en
Pages : 192
View: 391

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Book Description: Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Silicon Carbide Mems Devices For Harsh Environments

Silicon Carbide MEMS Devices for Harsh Environments PDF Book Detail:
Author: Andrew Ryan Atwell
Publisher:
ISBN:
Size: 76.65 MB
Format: PDF, ePub, Mobi
Category :
Languages : en
Pages : 336
View: 5295

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Book Description: The theory, design methodology, simulation technique, fabrication technique and evaluation results are presented for a first-generation, single crystal 6H-silicon carbide piezoresistive MEMS pressure sensor and accelerometer designed for extreme shock and vibration, high pressure and high temperature environments. The design methodology took into account the safe operating stress, high stiffness and high natural frequency of silicon carbide diaphragms to develop the sensor. Finite element analysis was carried out to verify the design principles and to further understand the mechanics of the sensing structures. Fabrication methods were developed to bulk micromachine the sensors from a single crystal silicon carbide substrate using deep reactive ion etching techniques. After packaging, the sensors were tested in pressure or shock testing modes. For the pressure sensors, a sensitivity of 31 nV/Pa was measured at room temperature. For the inertial sensors, sensitivities between 50 and 343 nV/g were measured for different accelerometer configurations at shock levels up to 42,000 g. However, non-linear behavior was observed over the shock range relative to the commercial benchmark accelerometer. These initial results verify the potential application of silicon carbide sensors in environments that exceed the capability of silicon-based devices and include extreme impact sensing and high-pressure environments where the temperature may reach 600°C and strong electromagnetic fields may exist.

Iwipp

IWIPP PDF Book Detail:
Author:
Publisher:
ISBN:
Size: 28.28 MB
Format: PDF, Kindle
Category : Electronic packaging
Languages : en
Pages :
View: 3496

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Book Description: